Join Teledyne LeCroy and Professor Eric Bogatin for this series of 60-minute webinars that describe best practices in design, test, measurement and debug of high-speed serial data links, including implementation of 2x-Thru algorithms for de-embedding test fixtures and other elements as described in the IEEE 370-2020 Standard.
These webinars serve as a springboard for further learning. Each topic will be explored further through a series of videos and coursework through the Teledyne LeCroy Signal Integrity Academy, available soon.
Part 2: Fundamentals of De-embedding in High-Speed Serial Data Links
Date: Thursday, September 10, 2026
Time: 11:00AM Pacific | 2:00PM Eastern
Duration: 60 minutes
In this webinar, Eric reviews why de-embedding is necessary and explains the math that underlies the de-embedding calculations as well as the process by which the measured test fixture is removed from the device-under-test measurement (as described in the IEEE 370-2020 standard). Eric explains and compares the 2x-Thru, 1x-Thru and in situ methods and provides a live demonstration using a test fixture board and various test boards.
Can’t attend live? Register anyway and you will receive an email with the recording and slides after the live event.