Join Teledyne LeCroy and Professor Eric Bogatin for this series of 60-minute webinars that describe best practices in design, test, measurement and debug of high-speed serial data links, including implementation of 2x-Thru algorithms for de-embedding test fixtures and other elements as described in the IEEE 370-2020 Standard.
These webinars serve as a springboard for further learning. Each topic will be explored further through a series of videos and coursework through the Teledyne LeCroy Signal Integrity Academy, available soon.
Part 4: Using Measurement-based S-parameter Models for High-speed Serial Links
Date: Thursday, March 4, 2027
Time: 11:00AM Pacific | 2:00PM Eastern
Duration: 60 minutes
In this webinar, Eric gets into the details about how to de-embed interconnects from fixtured test boards to the IEEE 370-2020 standard. Eric will perform a simulation validation by comparing an HFSS simulation with an actual measurement using a WavePulser 40iX, and describe how to apply various open-source simulation tools, such as QUCS, PyAnsys, PySi, and PyBERT, along with HyperLynx and MATLAB for system simulation.
Can’t attend live? Register anyway and you will receive an email with the recording and slides after the live event.