Join Teledyne LeCroy and Professor Eric Bogatin for this series of 60-minute webinars that describe best practices in design, test, measurement and debug of high-speed serial data links, including implementation of 2x-Thru algorithms for de-embedding test fixtures and other elements as described in the IEEE 370-2020 Standard.
These webinars serve as a springboard for further learning. Each topic will be explored further through a series of videos and coursework through the Teledyne LeCroy Signal Integrity Academy, available soon.
Part 1: Understanding High-Speed Interconnects Using S-Parameters
Date: Thursday, June 11, 2026
Time: 11:00AM Pacific | 2:00PM Eastern
Duration: 60 minutes
In this webinar, Eric provides an overview of S-parameters and impedance profiles and explains how the serial link and interconnect geometry correlate to the frequency and time domain measured behaviors. Eric will perform some live demonstrations using various faulty test boards and high-quality test boards.
Can’t attend live? Register anyway and you will receive an email with the recording and slides after the live event.