There are two ways to attend COMPASS this year: virtually or in-person watch parties! Learn More
The 2023 COMPASS Theme is Megatrends in Test and Measurement
FormFactor’s COMPASS test and measurement community event brings together FormFactor customers from around the world to discuss the products and technologies shaping our future. Industry leaders and speakers from corporations, leading-edge research institutions and FormFactor share test insights on a wide variety of emerging applications including 5G, trends in advanced packages, next generation memories and other devices, ultra-low noise testing, cryogenic probing and millimeter-wave measurement and calibration.
Two Ways to Participate in COMPASS 2023!
Virtual – Enjoy COMPASS wherever you are.
A link will be provided for you to join from your device.
Watch Party – Join us at one of our watch party locations throughout the world.
Hear COMPASS presentations and network with attendees and technical staff.
All COMPASS events are no charge
Dr. Deepak Kulkarni
Fellow, Advanced Packaging, AMD
Keynote Presentation – Advanced Packaging: Enabling Moore’s Law’s Next Frontier
Chiplet architectures are fundamental to the continued economic viable growth of power efficient computing. Thus, the criticality of advanced packaging technologies and architectures correlated to Moore’s Law’s next frontier is high. New heterogeneous architectures, along with AMD’s industry leading advanced packaging roadmap, enable power, performance, area, and cost (PPAC). PPAC considerations per product influence the choice of Substrate (2D), Fanout based (2.5D) and Hybrid Bonded (3D) technologies and will be addressed in this keynote. Finally, AMD’s High Performance Fanout previewed in the RDNA3 architecture along with enabling technologies like power delivery and thermal improvements will be detailed.
Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds eight patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.