TMS Divisions:

Test & Measurement Embedded Systems   Distribution

Upcoming Events 

To view previous Webinars, please visit our Application Notes & Videos Page

Introduction to boundary-scan - US


When: Wed, Jan. 17, 2018 from 12:00PM to 1:00PM MST

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Abstract:

An eye-opener in the world of structural testing. What is JTAG. How does it work and how to start testing and programming printed circuit boards.

Debugging IoT (Internet of Things) using Oscilloscopes


When: Thu, Feb. 22, 2018 at 2:00PM EST

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Abstract:

The Internet of Things (IoT) is a term coined by tech developer Kevin Ashton to describe the interconnected network of physical devices and vehicles that electronically collect and share data using embedded sensors. IoT devices are deeply embedded systems comprised of SoCs, DDR Memory, Power Management ICs, Wireless LAN ICs, and microcontrollers which utilize low speed serial communication protocols such as UART, I2C, SPI etc. to name a few.

The number of IoT devices connected to the internet is projected to reach 20 Billion in 2020 – up from 8 Billion in 2017. The emergence of Augmented Reality, Artificial Intelligence (AI) and IoT technologies will drive the next industrial revolution - IoT provides the data AI needs in order to make smart decisions.

The IoT device is an ecosystem rich with signals Teledyne LeCroy oscilloscopes and application tools excel in characterizing. This presentation will demonstrate Teledyne LeCroy’s extensive set of innovative industry leading oscilloscope debug and analysis tools, application packages, and specialty probes available for the end user to validate and debug their IoT designs.

Topics will include:

  • Bluetooth and 802.11 wireless communication signals using
    Vector Signal Analysis (VSA) and demodulation capabilities

  • Triggering on and decoding low speed serial communication signals such as I2C, UART, and SPI

  • Debugging DDR memory interfaces

  • Clock signal stability and jitter analysis

  • Digital power management

 

Low Frequency Passive and High Frequency Active Probing Techniques and Tradeoffs - What to Use and Why


When: Available on Demand

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Abstract:

Connectivity, system bandwidth, rise time, and probe location must be carefully considered when probing any target. In addition, the non-ideal probe exhibits parasitic effects that interact with the DUT and can pollute the measurement if not managed properly.

Engineers must commonly probe low and high frequency signals with high signal fidelity. Typical passive probes with high input impedance and capacitance provide good response at lower frequencies, but inappropriately load the circuit and distort signals at higher frequencies. 

Join Teledyne LeCroy for this webinar as we discuss: 
  • Selecting the right probing techniques to maximize the accuracy of your measurements
  • Probe specifications and their implications on the measured signal
  • Variety of probes and accessories available for measurement
  • Virtual probing software tools that allow the user to probe the signal when direct access is physically impossible

 

Presenter: Mark Lionbarger, Field Applications Engineer

 

 

Oscilloscope Automation and Making Custom Measurements Using MATLAB and VB


When: Available on Demand

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Abstract:

 

This webinar focuses on fast and easy methods to enhance functionality by incorporating custom routines and user-defined algorithms directly into the scope processing path. 

Topics covered will include: Scripting, custom math and measurement examples using MATLAB, Visual Basic Script, Excel Math, C++, and Visual Basic for Applications, combining in-line user-written algorithms and built-in oscilloscope algorithms, dynamic automation, user-defined interfaces, embedding algorithms into panel setups, measurements and math operators, in-line real-time decisions, peak finding, custom filters, inverse FFT, dynamic searching, COM automation and remote control using MATLAB and Visual Basic.
 

Presenter: Mike Hertz, Sr. Field Applications Engineer, Teledyne LeCroy

Cost: Free

 

 

Easy Data Center Testing up to 100Gbps


When: Available On Demand

Duration: 19 minutes


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Abstract:
Increased copper & fiber optic cabling within Data Centers drive client installation and verification demands.  Data Center Operations struggle to install, verify and troubleshoot client connections and Data Center Interconnects deployed daily in expanding data centers that require a hand-held, all-in-one tool for testing and troubleshooting at all data rates, using any given interface, located anywhere in the data center. 

 

This brief presentation describes the capabilities and ease of use of the Anritsu MT1x00A Network Master Series for copper and fiber cable testing and verification in one-step.

 
 

Presented by Danny Gonzalez - Optical Transport Business Development Manager at Anritsu Company. Daniel Gonzalez possesses over 16 years’ experience in digital and optical transport testing, development, training and execution spanning technologies including TDM, SONET, OTN, ATM, Carrier Ethernet and Physical Layer Signal Integrity.

 

As an Optical Transport Business Development Manager for Anritsu Company, Daniel is responsible for providing technical support to sales, marketing & customers in North & South America. Daniel holds a B. S. in Telecommunications Management from DeVry University,          is a member of OIF (Optical Internetworking Forum) Networking & Operations Working Group (WG), member of IEEE Communications Society (ComSoc) & has his MEF (Metro Ethernet Forum) Carrier Ethernet 2.0 Professional Certification. He also has several of his articles published in Lightwave, ISE Magazine, Mission Critical and Pipeline publications.