TMS Divisions:

Test & Measurement Embedded Systems   Distribution

Upcoming Events 

To view previous Webinars, please visit our Application Notes & Videos Page

Introduction to boundary-scan - US



When: Tue, September 26, 2017

Time: 8:00 AM MDT


REGISTER HERE

Abstract:
An eye-opener in the world of  structural testing.

 

 

USB 3.1 Gen 2 Compliance Testing and Debug - Live Webinar



When: Wed, September 27, 2017

Time: 11:00 AM PDT | 2:00 PM EDT


REGISTER HERE

Abstract:

USB has been a very popular standard for data transfer on multiple platforms for many years. The latest edition of the standard called USB 3.1 Gen 2 or SuperSpeed USB 10Gbps has gained popularity in the industry. The introduction of the smaller form factor Type-C connector and it’s applications in power delivery and display signals has led to wider implementation of this standard, particularly in cell phones and other mobile devices. The higher data rate associated with the standard offers tougher challenges during development and testing. 


Join Teledyne LeCroy for this free webinar as we analyze the major changes in the standard compared to its previous versions and offer solutions for compliance testing and debug to help in analysis and characterization of USB 3.1 Gen 2 signals and interfaces. The physical layer transmitter and receiver compliance tests, including the necessary test instrumentation such as oscilloscopes and the PERT Receiver tester will be discussed in detail. In addition, a few debug and analysis techniques will be presented. 
 
 

Presented by Karthik Radhakrishna, Field Applications Engineer

 

 

Practical Current Measurement with a Precision Power Analyzer

When: Wed, September 27, 2017

Time: 11:00 AM PDT | 2:00 PM EDT


REGISTER HERE

Abstract:
As inverters, motors, and other power conversion systems become increasingly efficient, power measurement and analysis is more important than ever. In order to create these accurate power measurements, one must choose among a variety of current measurement approaches. While many applications can use the built-in current measurement capability of a power analyzer, others will require an external current transducer for the job.

 

In this live webcast, attendees will learn:

  • Fundamentals of current measurement
  • Criteria for selecting the correct current transducer
  • Alternatives for current measurement
  • How to connect a CT to a power analyzer

 

Presented by Sam Shearman, Product Manager

 

 

Compass 2017


When: October 18-20, 2017

Where: Half Moon Bay, CA


REGISTER HERE

COMPASS 2017 Preliminary Program Agenda Available!

 

Our fifth users’ conference, COMPASS 2017 offers another great lineup of thought-provoking topics presented by industry experts. Don't miss this unique opportunity to be a part of in-depth technical sessions on the latest advancements in test and measurement technologies, and to learn about best practices using FormFactor and Cascade Microtech products and emerging applications including: 
 

  • Optoelectronics/Photonics: Columbia University, Keysight Technologies, imec
  • Advanced Testing: T.I.P.S, Infineon, Intel
  • Reliability/Parametric: SCL, SUNY, FormFactor, XFAB
  • RF/mmW Probing: Roos, FormFactor, Karlsruhe Institute of Technology
  • Power Devices: UC Davis, Celadon
  • Production Test: imec, FormFactor, Texas Instruments

 

Ralf Herrtwich, Head of Automotive Business Group for HERE, will kick off COMPASS 2017 with the keynote address“Maps for Cars by Cars.” On the second day, Octavio Martinez, Vice President of Engineering at Qualcomm, will deliver the featured session “Probing and Testing Challenges in the 5G Era.”
 

In addition to over 20 technical sessions, COMPASS 2017 provides excellent networking opportunities to get connected with our speakers, industry peers, as well as our solution partners and our executive management team. Check out the COMPASS 2017 Agenda to learn more and register for this educational forum.

 

EARLY-BIRD REGISTRATION: $200 USD BEFORE AUGUST 25

STANDARD REGISTRATION: $250 USD

 

 

 

Easy Data Center Testing up to 100Gbps


When: Available On Demand

Duration: 19 minutes


REGISTER HERE

Abstract:
Increased copper & fiber optic cabling within Data Centers drive client installation and verification demands.  Data Center Operations struggle to install, verify and troubleshoot client connections and Data Center Interconnects deployed daily in expanding data centers that require a hand-held, all-in-one tool for testing and troubleshooting at all data rates, using any given interface, located anywhere in the data center. 

 

This brief presentation describes the capabilities and ease of use of the Anritsu MT1x00A Network Master Series for copper and fiber cable testing and verification in one-step.

 
 

Presented by Danny Gonzalez - Optical Transport Business Development Manager at Anritsu Company. Daniel Gonzalez possesses over 16 years’ experience in digital and optical transport testing, development, training and execution spanning technologies including TDM, SONET, OTN, ATM, Carrier Ethernet and Physical Layer Signal Integrity.

 

As an Optical Transport Business Development Manager for Anritsu Company, Daniel is responsible for providing technical support to sales, marketing & customers in North & South America. Daniel holds a B. S. in Telecommunications Management from DeVry University,          is a member of OIF (Optical Internetworking Forum) Networking & Operations Working Group (WG), member of IEEE Communications Society (ComSoc) & has his MEF (Metro Ethernet Forum) Carrier Ethernet 2.0 Professional Certification. He also has several of his articles published in Lightwave, ISE Magazine, Mission Critical and Pipeline publications.